Tailored SECS/GEM and factory automation solutions for every segment of the manufacturing industry — from 300mm wafer fabs to SMT assembly lines.
The semiconductor front end (wafer fab) segment defines a series of standards known as the GEM300 standards, including SEMI standards E40, E87, E90, E94, E116, E148, and E157. These provide additional features to the GEM interface while building upon SEMI E30.
300mm factories worldwide use the underlying GEM standard's data collection features to monitor specific equipment activity such as wafer movement and process job execution. The SECS/GEM standard and additional GEM300 standards are required on almost all 300mm wafer manufacturing tools.
NexSecs/Gem 300 SDK for equipment makers, NexSecs/Gem EAP+ for factory host integration.
Numerous types of equipment in the semiconductor back end (assembly and test) segment implement the GEM standard. Additional standards have been defined for specific equipment types including testers (SEMI E122 — TSEM) and handlers (SEMI E123 — HSEM).
NexSecs/Gem provides the communication layer that connects wire bonders, die bonders, testers, handlers, and other back-end equipment to factory host systems for seamless monitoring and control.
Many types of equipment in the surface mount technology (SMT) industry support the GEM standard, including chip placement, solder paste, oven, and inspection equipment. The GEM standard has been used on these equipment types for over 15 years.
NexSecs/Gem provides reliable SECS/GEM interfaces for SMT equipment makers to connect their tools to factory hosts, enabling efficient line monitoring and production control.
Our engineers have deep experience across diverse manufacturing segments. Let us help you design the right solution.